Semiconductors
Although TSMC can't claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to both improve productivity/uptime, and to cut down on the costs of using the ultra-fine tools. As part of the company's European Technology Symposium this week, they went into a bit more detail on their EUV usage history, and their progress on further integrating EUV into future process nodes. When TSMC started making chips using EUV lithography in 2019 on its N7+ process (for Huawei's HiSilicon), it held 42% of the...
ASML Delivers First 2nm-Generation Low-NA EUV Tool, the Twinscan NXE:3800E
Our avid readers tend to look at microelectronics made using leading edge process technologies, which in case of Intel means usage of High-NA extreme ultraviolet (EUV) lithography a couple...
2 by Anton Shilov on 3/13/2024
Marvell's 2nm IP Platform Enables Custom Silicon for Datacenters
Marvell this week introduced its new IP technology platform specifically tailored for custom chips for accelerated infrastructure made on TSMC's 2nm-class process technologies (possibly including N2 and N2P). The...
0 by Anton Shilov on 3/8/2024
Intel to Hold Webinar to Discuss Long-Term Vision for Foundry, Separating Fab and Design Reporting
As Intel prepares to move its fabs into its new Intel Foundry business, it will change the way it reports results in the coming months. To discuss the company's...
1 by Anton Shilov on 3/7/2024
Arm and Samsung to Co-Develop 2nm GAA-Optimized Cortex Cores
Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA...
3 by Anton Shilov on 2/22/2024
IFS Reborn as Intel Foundry: Expanded Foundry Business Adds 14A Process To Roadmap
5 nodes in 4 years. This is what Intel CEO Pat Gelsinger promised Intel’s customers, investors, and the world at large back in 2021, when he laid out Intel’s...
29 by Ryan Smith on 2/21/2024
GlobalFoundries to Receive $1.5 Billion In Funding from U.S. CHIPS Act
The United States Department of Commerce and GlobalFoundires announced on Monday that the US will be awarding GlobalFoundries with $1.5 billion in funding under the CHIPS and Science Act...
5 by Anton Shilov on 2/20/2024
GlobalFoundries: Clients Are Migrating to Sub-10nm Faster Than Expected
When GlobalFoundries abandoned development of its 7 nm-class process technology in 2018 and refocused on specialty process technologies, it ceased pathfinding, research, and development of all technologies related to...
26 by Anton Shilov on 2/14/2024
ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities
ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only...
8 by Anton Shilov on 2/14/2024
Global Semiconductor Sales Hit $526.8 Billion in 2023
The global semiconductor industry saw its sales dropped around $47 billion to nearly $527 billion in 2023, according to estimations by the Semiconductor Industry Association (SIA). This was a...
13 by Anton Shilov on 2/9/2024
TSMC to Build Second Fab in Japan: 6nm and 7nm Coming to Japan
Taiwan Semiconductor Manufacturing Co. on Tuesday formally announced plans to build a second fab in Japan. The fab will be run by Japan Advanced Semiconductor Manufacturing (JASM), a majority-owned...
4 by Anton Shilov on 2/6/2024
Intel Teams Up with UMC for 12nm Fab Node at IFS
Intel and UMC on Thursday said they had entered into an agreement to jointly to develop a 12 nm photolithography process for high-growth markets such as mobile, communication infrastructure...
12 by Anton Shilov on 1/25/2024
Intel's First High-Volume Foveros Packaging Facility, Fab 9, Starts Operations
Intel this week has started production at Fab 9, the company's latest and most advanced chip packaging plant. Joining Intel's growing collection of facilities in New Mexico, Fab 9...
2 by Anton Shilov on 1/25/2024
TSMC 2nm Update: Two Fabs in Construction, One Awaiting Government Approval
When Taiwan Semiconductor Manufacturing Co. (TSMC) is prepping to roll out an all-new process technology, it usually builds a new fab to meet demand of its alpha customers and...
38 by Anton Shilov on 1/19/2024
TSMC Posts Q4'23 Earnings: 3nm Revenue Share Jumps to 15%, 5nm Overtakes 7nm For 2023
Taiwan Semiconductor Manufacturing Co. released its Q4'2023 and full year 2023 financial results this week. And along with a look at the financial state of the firm as it...
2 by Anton Shilov on 1/19/2024
Synopsys to Acquire Ansys: Set to Offer EDA, Analysis, and Simulation Tools
Synopsys on Tuesday announced that it had reached a definitive agreement to acquire Ansys in a deal valued at $35 billion. Synopsys specializes primarily on electronic design automation (EDA...
0 by Anton Shilov on 1/16/2024
ASML's First High-NA EUV Litho Scanner Arrives At Intel [UPDATED]
Update 1/5/2024: Intel Oregon announced on Thursday that it has received its shipment of ASML's first-generation Twinscan EXE:5000 High-NA EUV lithography scanner. The two companies will start assembly process...
28 by Anton Shilov on 1/5/2024
Intel Reiterates: We Are Not Going to Spin Off IFS
When Intel struggled with its 10nm process technology a few years ago, some investors suggested that the company would be better-off spinning its chip production into an independent foundry...
42 by Anton Shilov on 12/15/2023
TSMC Solidifies Leadership on Foundry Market as Intel Jumps into Top 10
The global foundry industry witnessed a substantial rise in demand in the third quarter of 2023, according to TrendForce. The Top 10 foundries collectively saw their revenue soar to...
7 by Anton Shilov on 12/6/2023
Amkor to Build $2 Billion Chip Packaging Fab in Arizona Primarily for Apple
Amkor, the world's second largest independent outsourced semiconductor assembly and test (OSAT) service provider, has announced their intention to build a new advanced chip packaging facility in the U.S...
12 by Anton Shilov on 12/4/2023
Samsung's Next-Gen 3nm and 4nm Nodes on Track for Mass Production in 2H 2024
Samsung is set to start making chips using its 2nd Generation 3nm-class (SF3) manufacturing technology as well as performance-enhanced version of its 4nm-class (SF4X) fabrication process in the second...
9 by Anton Shilov on 11/2/2023
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